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In order to better understand the consulting services and the expertise offered by Electronic Cooling Solutions, a partial list of products that the ECS engineering staff have had experience in supporting is shown. | | |
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Selected Projects |
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| Periodic |
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Transient Analysis of an SOT223 device on a JTEC Board |
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Determine the periodic steady state temperature of the SOT223 device. The power on each device was increased from 0 W to 80 W in 10 milliseconds and then brought back to 0 W in another millisecond. This resulted in a time lag of 8 ms between the powering of each device. CFD simulation involved capturing the effect of the repeated triangular shaped peak power curves in such a very small time frame. |
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Analysis of the transient thermal response of solder interconnects on packaging substrates during infrared re-flow processing |
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Design optimization: IR power level, power function, lamp-to-surface distance, mask material, thickness, shape, surface properties |
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IR measurements to check heat flux uniformity, and quantify the effect of mask |
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Transient thermal analysis of the cooling phase for a DVD sputtering process |
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Quantifying the effects of gas pressure and material properties on the cooling rate (Gases considered in analysis: Argon, Nitrogen and Helium) |
| Rack Exhaust HEX |
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Rack exhaust or rear door liquid-air heat exchanger analysis |
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Carry out preliminary system and heat exchanger thermal analysis utilizing CFD and NTU Methodology to determine thermal design specification requirements |
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Source and partner with key suppliers to develop and finalize thermal design |
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Influence key suppliers technology roadmap development work based on the future requirements of our customers |
| Servers |
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Design of an impingement cooling system for a high performance computer server product |
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Board level analysis of impingement cooling design concept |
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Evaluation of system airflow and system level thermal performance of impingement cooling design |
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Design of software for data acquisition |
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Analysis of blower design issues and implementation of design refinements |
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Design of Cooling System for Multiprocessor Super-Server product |
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Board level analysis of cooling requirements for high performance boards with multiple processors and ASICs, including design and selection of heat sinks. |
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Design and construction of necessary circuitry to power resistor networks within thermal die and extract and interpret data from sense circuitry. |
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Assessment of system airflow requirements and design of solution including blower selection and placement, specification of plenum requirements, and design of necessary ducting. |
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