Electronic Cooling Solutions

Date	Title	Conference / Venue
February, 2010	New Approach to System Server Air Flow/Thermal Design Development, Validation & Advancement in Green Fan Performance Increasing thermal demands of high-end servers require increased performance of air-cooling systems in order to meet industry requirements. Increased air cooling performance will be attained through efficient distribution of the air flow to multiple electronic modules and improved aerodynamic power conversion efficiency of the server air movers and incorporating inter-stage air flow directional control structure between tandem fans that are arranged in series air flow. A new approach is used to measure and validate air flow rates for the server’s individual electronic modules.	SEMI-THERM 26 Hyatt Regency Hotel Santa Clara, California USA
February, 2010	Low Profile Heat Pipe Heat Sink & Green Performance Characterization for Next Generation CPU Module Thermal Designs Increasing thermal demands of high-end server CPUs require increased performance of air-cooling systems to meet industry needs. Improving the air-cooled heat sink thermal performance is one of the critical areas for increasing the overall air-cooling limit. One of the challenging aspects for improving the heat sink performance is the effective utilization of relatively large air-cooled fin surface areas when heat is being transferred from a relatively small heat source (CPU) with high heat flux.	SEMI-THERM 26 Hyatt Regency Hotel Santa Clara, California USA
October 7, 2009	Validation Studies of DELPHI-type Boundary-Condition-Independent Compact Thermal Model for an Opto-Electronic Package A Boundary-Condition-Independent (BCI) Compact Thermal Model (CTM) was generated for an opto-electronic transceiver package called SFP (Small Form-factor Pluggable device). The SFP has four internal power dissipating sources and the BCI CTM for the SFP was developed using the DELPHI methodology. This paper presents a detailed validation of the BCI CTM of the SFP in real-time applications using Flotherm, a Computational Fluid Dynamics (CFD)-based thermal analysis software package.	Therminic 2009, Leuven, Belgium
July 19, 2009	Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages An introduction to boundary condition independent reduced-order modeling of complex electronic components using the Proper Orthogonal Decomposition (POD)-Galerkin approach is presented in this extended abstract. Current work focuses on how the POD methodology can be used with the Finite Volume Method (FVM) to generate reduced-order models that are boundary condition independent.	Interpack 2009, San Franciso, California USA
July 15, 2009	Innovative Rack-Level Cooling Solutions The presentation is limited to cooling solutions only at the rack level using a closed racks and commercially available products.	Huawei Symposium 2009, Palo Alto, California USA